John Lau, Cheng Lee, C. Premachandran, and Yu Aibin, "Advanced MEMS Packaging"
Publisher: McGraw-Hill Professional | ISBN: 0071626239 | edition 2009 | PDF | 577 pages | 13,9 mb
A comprehensive guide to 3D MEMS packaging methods and solutions Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenges created by the ever-increasing interest in MEMS devices and packaging. This authoritative guide presents cutting-edge MEMS (microelectromechanical systems) packaging techniques, such as low-temperature C2W and W2W bonding and 3D packaging.
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